Wednesday August 22 | - Continental Breakfast: 7:30-8:30am
- Introductory Remarks: 8:30-8:45am
- Keynote: Internet - Hot or Cold 8:45-10:00am
- Tom Lyon (Founder, Ipsilion)
- Break: 10:00-10:30am
- Session 1: Packet Scheduling and Classification: 10:30-Noon
Session Chair: Balaji Prabhakar, Stanford University - Lunch: 12:00-1:30pm
- Session 2: High-Speed Interconnects: 1:30-3:00pm
Session Chair: Fred Bauer, Nokia - Synfinity II -- A High-Speed Interconnect with 2GBytes/sec Self-Configurable Physical Link:
Yoichi Koyanagi, Takeshi Horie, Takashi Miyoshi, Mitsuo Ishii, Fujitsu Laboratories of America and Hiroshima University - Optical Interconnection as an Intellectual Property of a CMOS Library:
Takashi Yoshikawa, Ichiro Hatakeyama, Kazunori Miyosi, and Kazuhiko Kurata, NEC - Sun Fireplane SMP Interconnect:
Alan Charlesworth, Sun Microsystems - TCPSwitching: Exposing Circuits to IP:
Pablo Molinero-Fernández, Nick McKeown Stanford University
- Break: 3:00-3:30pm
- Session 3: Network Attached Storage and Memory: 3:30-5:00pm
Session Chair: Daniel Pitt, Nortel Networks - Dinner: 5:30-6:30pm (in courtyard)
- Panel: The Future of MPLS: 6:30-8:00pm (in courtyard)
- Session Chair: Bruce Davie (Cisco)
- Yakov Rekhter (Juniper Networks)
- Thomas Telkamp (Global Crossing)
- Simon Crosby (CPlane)
- Nick McKeown (Stanford University)
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Thursday August 23 | - Continental Breakfast: 7:30-8:30am
- Invited Session: IPv6: 8:30am-10:00am
- Break: 10:00-10:30am
- Session 4: Network Protocol Design and Evaluation: 10:30-Noon
Session Chair: Ibrahim Matta, Boston University - Deferred Segmentation for Wire-Speed Transmission of Large TCP Frames over Standard Gb/s Ethernet:
Hrvoje Bilic, Yitzhak Birk, Igor Chirashnya, Zorik Machulsky, IBM and Israel Inst. of Technology - Evaluation of SCSI Over TCP/IP and SCSI Over Fibre Channel Connections:
Huseyin Simitci, Chris Malakapalli, Vamsi Gunturu, XIOTech - Layered Protocol Wrappers for Internet Packet Processing in Reconfigurable Hardware:
Florian Braun, John Lockwood, Marcel Waldvogel, Washington University - Quality of Service Guarantee on 802.11 Networks:
Srikant Sharma, Kartik Gopalan, Ningning Zhu, Pradipta De, Gang Peng, Rether Networks
- Lunch: 12:00-1:30pm
- Session 5: Switch Design and Architecture 1:30-3:00pm
Session Chair: John Lockwood, Washington University - Analysis of a Statistics Counter Architecture:
Devavrat Shah, Sundar Iyer, Balaji Prabhakar, Nick McKeown, Stanford University - The Alpha 21364 Network Architecture:
Shubhendu S. Mukherjee, Peter Bannon, Steven Lang, Aaron Spink, and David Webb, Compaq - RHiNET-3/SW: an 80-Gbit/s high-speed network switch for distributed parallel computing
S. Nishimura, T. Kudoh, H. Nishi, J. Yamamoto, R. Ueno, K. Harasawa: S. Fukuda, Y. Shikichi, S. Akutsu, K. Tasho, and H. Amano, Hitachi, Real-World Computing Partnership, Keio Univ, Synergetech - The Quadrics Network (QsNet): High-Performance Clustering Technology:
Fabrizio Petrini, Wu-chun Feng, and Adolfy Hoisie, Los Alamos National Laboratory
- Break: 3:00-3:30pm
- Session 6: Interconnect and Circuit Technologies: 3:30-5:00pm)
Session Chair: Nick McKeown, Stanford University - Analysis and Avoidance of Cross-talk in On-Chip Buses:
Chunjie Duan, Anup Tirumala, Sunil P Khatri, Colorado - On the Techniques of Clock Extraction and Oversampling:
Henning Braunisch and Raj Nair, Intel - A Family of ASIC Devices for Next Generation Distributed Packet Switches with QoS Support for IP and ATM:
Fabio M. Chiussi, Alberto Brizio, Andrea Francini, Kevin Grant, Khurram Kazi, Denis Khotimsky, Santosh Krishnan, Sheng Shen, Mohammad Syed, Thomas Wasilewski, Lucent - New World Campus Networking:
Norival Figueira, Paul Bottorff, and Huiwen Li, Nortel Networks |
Friday August 24 | - Tutorials
- Tutorial 1: MPLS for Traffic Engineering
Bruce Davie, Cisco Systems, Inc. - Tutorial 2: Title: InfiniBand Architecture
Dhabaleswar K. Panda, The Ohio State University - Tutorial 3: Bluetooth Vs. 802.11
Pravin Bhagwat, ReefEdge, Inc. - Tutorial 4: Control & Management of Modern Optical Networks
Debanjan Saha and Sudipta Sengupta, Tellium, Inc. |