SPONSORED BY
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August
23 - 25, 2006
Stanford
University
Cubberly Auditorium (School of
Education building)
REGISTER
ONLINE NOW
Join us for our 14th
year of an information packed three day Symposium about
the latest in High Performance Interconnects. IEEE
Hot Interconnects brings
together architects and designers of high performance
chips, software, and systems at the University and global
business levels. Presentations focus on up-to-the-minute
developments demonstrating leading-edge designs by
engineers and researchers throughout the world.
Two days of technical sessions led by James Sterbenz and
Fabrizio Petrini , our 2006 General Co-Chairs followed by one day of tutorials to keep you on top
of the latest
industry
developments and academic laboratories.
Advance
Program NOW ONLINE
Our objective is to address the Networking and SuperComputing
families.
This
year we are proud to have Tal Lavian with Nortel Networks, Dhabaleswar
Panda from Ohio State University as our 2006 IEEE Hot Interconnects Program
Co-Chairs. They are putting together a combined 'HOT' program that includes interconnects
in Super Computing.
2006 Important Dates* |
April 22 |
Long Paper Submissions Due |
May 18 |
Notification of Acceptance |
July
31 |
Early Registration Start |
August 16 |
Early Registration End at midnight |
August 23 |
On-site Registration Start at 7:30 am |
August 23-24 |
2-day Sessions |
August 25 |
Full day and 1/2 day Tutorials |
*subject to change |
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