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August 23 - 25, 2006
Stanford University
Cubberly Auditorium (School of Education building)


REGISTER ONLINE NOW
Join us for our 14th year of an information packed three day Symposium about the latest in High Performance Interconnects. IEEE Hot Interconnects brings together architects and designers of high performance chips, software, and systems at the University and global business levels. Presentations focus on up-to-the-minute developments demonstrating leading-edge designs by engineers and researchers throughout the world.

Two days of technical sessions led by James Sterbenz and Fabrizio Petrini , our 2006 General Co-Chairs followed by one day of tutorials to keep you on top of the latest industry developments and academic laboratories.


Advance Program NOW ONLINE
Our objective is to address the Networking and SuperComputing families. This year we are proud to have Tal Lavian with Nortel Networks, Dhabaleswar Panda from Ohio State University as our 2006 IEEE Hot Interconnects Program Co-Chairs. They are putting together a combined 'HOT' program that includes interconnects in Super Computing.


  2006 Important Dates*
  April 22 Long Paper Submissions Due
  May 18 Notification of Acceptance
  July 31 Early Registration Start
  August 16 Early Registration End at midnight
  August 23 On-site Registration Start at 7:30 am
  August 23-24 2-day Sessions
  August 25 Full day and 1/2 day Tutorials
*subject to change

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