Keynote: Powering Llama 3
Title: Powering Llama 3: A Sneak-peek into Meta's Massive Infrastructure for Generative AI Abstract: We trained a model. It used a whole lot of GPUs and a giant network. We wrote […]
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Can Interconnects Keep up with AI? YES
Title: Can Interconnects Keep Up with AI? YES! Abstract: The bandwidth requirements of AI clusters represent an unprecedented challenge to improve the cost, power, and reliability of AI Fabric interconnects. […]
Standardizing Interconnect Test and Repair: Motivation and On-Going Effort
Title: Standardizing Interconnect Test and Repair: Motivation and On-Going Effort Abstract: Chip-let based design, fueled by various advanced packaging technologies, is projected to revolutionize the semiconductor industry. This brings along […]
Ultra Ethernet Consortium
Title: Ultra Ethernet Consortium (UEC) overview – solving the AI/HPC Scale-Out Network Challenge Abstract: The industry race for an ever faster, better, lower total cost of ownership (TCO), easy to […]