IEEE Hot Interconnects | Stanford University

Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from on-chip processor--memory interconnects to wide-area networks. This yearly conference is very well attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited in the topics listed below. (click here for a downloadable, printable PDF)

Call for Papers

•	Novel and innovative interconnect architectures
•	Multicore processor interconnects
•	Advanced chip-to-chip communication technologies
•	Optical interconnects
•	Protocols and interfaces for interprocessor communication
•	Survivability and fault-tolerance of interconnects
•	High-speed packet processing engines and network processors
•	System and storage area network architectures and protocols
•	High-performance host–network interface architectures
•	High-bandwidth and low-latency I/O
•	Tb/s switching and routing technologies
•	Innovative architectures for supporting collective communication
•	Novel communication architectures to support grid computing
•	New results with backplanes for Advanced Telecom Computing Architecture (ATCA) networking systems

Submission Guideline - FULL PAPERS
•	Papers need sufficient technical detail to judge quality and suitability for presentation.
•	Submit title, author, abstract, and full paper (six pages, double-column, IEEE format).
•	Papers should be submitted electronically at http://edas.info/4826 for Hot Interconnects 14.
•	Submission deadline: April 22, 2006
•	Notification of acceptance: May 18, 2006
•	For further information, please, see hoti14/cfp/

About the Conference
•	Conference held at the William Hewlett Teaching Center at Stanford University.
•	Papers selected will be published in proceedings by the IEEE Computer Society.
•	Revised versions of selected papers will be invited to a special issue of IEEE Micro magazine.
•	Presentations are 30-minute talks in a single-track format
•	Online information at http://www.hoti.org

Technical Program Committee
	Adnan Aziz - University of Texas, Austin, USA Alan Benner - IBM, USA Andrea Bianco - Politecnico di Torino, Italy Ron Brightwell - Sandia National Laboratory, USA Piero Castoldi - Scuola Superiore Sant'Anna, Italy Sarang Dharmapurikar - Washington University, St. Louis, USA Hans Eberle - Sun Microsystems, USA Juanf Fernandez - University of Murcia, Spain Andrea Fumagalli - University of Texas, Dallas Paolo Giaccone - Politecnico di Torino, Italy Mitchel Gusat - IBM Zurich, Switzerland Doan Hoang - University of Technology, Sydney, Australia Olav Lysne - Simula Research Lab, Norway Pankaj Mehra - HP, USA Rami Melhem - Univ. of Pittsburgh, USA Cyriel Minkenberg - IBM Zurich, Switzerland Greg Pfister - IBM, USA Danny Raz - Technion, Israel Yuval Shavitt - Tel Aviv University, Israel Craig Stunkel - IBM T.J. Watson Research Center, USA Anujan Varma - University of California, Santa Cruz, USA Joe (Zuoguo) Wu - Intel, USA