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IEEE Hot Interconnects 13 Committees
Steering Committee
 
Allen Baum, Intel
Daniel Pitt, Dean of Engineering, Santa Clara University
Mark Laubach, Broadband Physics 
Hasan Alkhatib, IP Dynamics
John Lockwood, Washington University in St. Louis
 
Organizing Committee
   
General Co-Chairs James Sterbenz, University of Kansas and Lancaster University, UK
  Dimitrios Stiliadis, Bell Labs
   
Technical Program Co-Chairs Fabrizio Petrini, Pacific Northwest National Laboratory
  Tal Lavian, Nortel Networks Labs and University of California at Berkeley
   
Publications Chair TBA
   
Sponsor/Patron Chair Mark Laubach
   
Treasurer
 Melinda Connors
   
Local Arrangements Chair
Registration Chair
Volunteer Coordinator
Webmaster		 Liz Group
Technical Program Committee
 Adnan Aziz, University of Texas, Austin
Alan Benner, IBM STSM (Server/Network Technology and Architecture)
Andrea Fumagalli, University of Texas, Dallas
Andrea Bianco, Politecnico di Torino
Anujan Varma, University of California, Santa Cruz
Bryan Lyles, Telecordia
Craig Stunkel, IBM
Danny Raz, Technion
Dimitrios Stiliadis, Bell Labs
Doan Hoang, University of Sidney
Fabio Chiussi, Invento Networks
Gigi Karmous-Edwards, MCNC Grid Computing and Network Services
Hans Eberle, Sun
James Sterbenz, University of Kansas and Lancaster University
Jay Lepreau, University of Utah
Joe Mambretti, Northwestern University
John Lockwood, Washington University in St. Louis
Paolo Giaccone, Politecnico di Torino
Patricia Sagmeister, IBM Research Zurich
Ron Brightwell, Sandia National Laboratory
Reuven Cohen, Technion
Sharad Agarwal, Microsoft
Silvia Figueira, Santa Clara University
Tom DeFanti, University of Illinois at Chicago
Yuval Shavitt, Tel Aviv University
Wojciech Kabacinski, Poznan University of Technology, Poland

 

    
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