Program | HotI30 (2023)

Program

All times are in UTC -7 (America/Los_Angeles)

Day 1 (Aug, 23rd)

Day 2 (Aug, 24th)

Day 3 (Aug, 25th)

Day 1 (Aug, 23rd)

Time (UTC-7)	Title
09:00	Introduction and Welcome Session Chair: Taylor Groves (Lightmatter)
09:15	Technical Paper Session A: Interconnect Standards Session Chair: Scott Levy (Sandia National Laboratory) Pipelined and Partitionable Forward Error Correction and Cyclic Redundancy Check Circuitry Implementation for PCI Express® 6.0 Debendra Das Sharma and Swadesh Choudhary (Intel). [SLIDE] Level 4 Autonomous Driving SoC, leveraging chiplet, advanced package and UCIe. Vinayak Agrawal (Intel), Francios Piednoel (Mercedes-Benz), Igor Elkanovich (Global Unichip), Mirza Jahan (Intel) and Sil Dwaipayan (Intel). [SLIDE]
10:15	Diamond Sponsor Talks Cornelis Huawei [SLIDE]
10:55	Break
11:00	Keynote – Accelerator Clusters: the New Supercomputer Speaker: Bill Dally (NVIDIA)
12:00	Lunch
12:30	Technical Paper Session B: In-Network Optimizations Session Chair: Sourav Chakraborty (Samsung) In-Network Compression for Accelerating IoT Analytics at Scale Rafael Oliveira and Ada Gavrilovska (Georgia Institute of Technology) [SLIDE ] Designing In-network Computing Aware Reduction Collectives in MPI Bharath Ramesh, Goutham Kalikrishna Reddy Kuncham, Kaushik Kandadi Suresh, Rahul Vaidya, Nawras Alnaasan, Mustafa Abduljabbar, Aamir Shafi, Hari Subramoni and Dhabaleswar Panda (The Ohio State University) [SLIDE]
13:30	Break
13:50	Panel: EtherNET vs EtherNOT … again? Moderator: Fabrizio Petrini (Intel) Panelists: Darius Bunandar (Lightmatter), Brad Burres (Intel), Larry Dennison (NVIDIA), Frank Helms (AMD), Torsten Hoefler (ETH Zurich), Tina Tsou (Arm)
15:20	The Head Bubba Memorial and HOTI Closing Remarks Day 1

Day 2 (Aug, 24th)

Time (UTC-7)	Title
09:00	Keynote – Industry Trends in High Performance Networking Speaker: Robert Hormuth (AMD) [SLIDE]
10:00	Platinum Sponsor Talks IBM
10:15	Break
10:30	Keynote – Ultra-high density photonic interconnect and circuit switching up to the wafer-level with Passage Speaker: Nicholas Harris (Lightmatter) [SLIDE]
11:30	Gold Sponsor Talks Arista [SLIDE] Nutanix [SLIDE]
11:50	Lunch
12:30	Technical Paper Session C: Smart NICs Session Chair: Arpan Jain (Microsoft) Characterizing Lossy and Lossless Compression on Emerging BlueField DPU Architectures. Yuke Li (UC Merced), Arjun Kashyap (UC Merced), Yanfei Guo (ANL) and Xiaoyi Lu (UC Merced). [SLIDE] Battle of the BlueFields: An In-Depth Comparison of the BlueField-2 and BlueField-3 SmartNICs.Benjamin Michalowicz (OSU), Kaushik Kandadi Suresh (OSU), Hari Subramoni (OSU), Dhabaleswar Panda (OSU) and Stephen Poole (LANL). [SLIDE]
13:30	Silver Sponsor Talks Algo-Logic
13:35	Break (Sponsored by Lenovo)
13:55	Technical Paper Session D: Networks for Large Language Models Session Chair: Dave Ozog (Intel) The Case for Domain-Specific Networks. Dennis Abts (NVIDIA) and John Kim (KAIST). [SLIDE] Performance Characterization of Large Language Models on High-Speed Interconnects. Hao Qi (UC Merced), Liuyao Dai (UC Merced), Weicong Chen (UC Merced), Zhen Jia (AWS) and Xiaoyi Lu (UC Merced). [SLIDE]
14:45	HOTI Closing Remarks Session Chair: Matt Dosanjh (Sandia National Laboratories)

Day 3 (Aug, 25th)

Track 1 Session Chair:
Time (UTC-7)	Title
08:00	High Performance Machine Learning, Deep Learning, and Data Science: Principles and Practice Dhabaleswar K. (DK) Panda, Hari Subramoni, Aamir Shafi, and Nawras Alnaasan (Department of Computer Science and Engineering, The Ohio State University)
11:00	Telemetry Tracing, Profiling, Analysis & Performance of workload offloads on Intel Scalable Processors with Integrated Accelerators Mrittika Ganguli, Karthik Raman, and Kalyan Jee (Intel)
12:00	Lunch
13:00	Networking Technologies for High-Performance Computing: Principles and Solutions Dhabaleswar K. (DK) Panda and Hari Subramoni (Department of Computer Science and Engineering, The Ohio State University)
16:00	Open Fabrics Interfaces Libfabric Rajalaxmi Angadi and Juee Himalbhai Desai (Intel)
Track 2 Session Chair:
Time	Title
08:00	Electro-optical and die-to-die Interconnect Technologies in Datacenters: Significance, Advantages, and Future Implications Priyank Shukla (Synopsys)
10:30	Understanding how microarchitecture impacts microservices Ashraf Mahgoub, Harshad Sane, and Kshitij Doshi (Intel)
11:30	High Performing and Predictable Java network programming Dinesh Kumar, Harshad Sane, Rodolfo De Vega, and Kshitij Doshi (Intel)
12:30	Lunch
13:00	Leveraging SmartNICs for HPC and Data Center Applications Jeffrey Young (Georgia Institute of Technology), Rich Graham (NVIDIA), Oscar Hernandez (Oak Ridge National Laboratory), and Richard Vuduc (Georgia Institute of Technology)